BCV47 TR PBFREE

BCV47 SURFACE MOUNT SILICON NPN DARLINGTON TRANSISTOR w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR BCV47 is a silicon NPN Darlington transistor manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for applications requiring extremely high gain. MARKING CODE: FG SOT-23 CASE MAXIMUM RATINGS: (TA=25°C) Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Collector Current Continuous Base Current Power Dissipation Operating and Storage Junction Temperature Thermal Resistance SYMBOL VCBO VCEO 80 UNITS V 60 V VEBO IC 10 V 500 mA ICM 800 mA IB PD TJ, Tstg 100 mA 350 mW -65 to +150 °C ΘJA 357 °C/W ELECTRICAL SYMBOL ICBO IEBO CHARACTERISTICS: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP VCB=30V VBE=10V BVCEO IC=10mA 60 V BVCBO IC=10µA IE=100nA 80 V BVEBO VCE(SAT) MAX 100 UNITS nA 100 nA 10 VBE(SAT) IC=100mA, IC=100mA, hFE VCE=5.0V, IC=1.0mA 2,000 hFE IC=10mA 4,000 hFE VCE=5.0V, VCE=5.0V, IC=100mA 10,000 fT VCE=5.0V, IC=30mA, f=100MHz V IB=0.1mA IB=0.1mA 220 1.0 V 1.5 V MHz R4 (21-October 2021) BCV47 SURFACE MOUNT SILICON NPN DARLINGTON TRANSISTOR SOT-23 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Base 2) Emitter 3) Collector MARKING CODE: FG SYMBOL A B C D E F G H I J DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.003 0.007 0.08 0.18 0.006 0.15 0.005 0.13 0.035 0.044 0.89 1.12 0.110 0.120 2.80 3.05 0.075 1.90 0.037 0.95 0.047 0.055 1.19 1.40 0.083 0.104 2.10 2.64 0.014 0.020 0.35 0.50 SOT-23 (REV: R4) R4 (21-October 2021) w w w. c e n t r a l s e m i . c o m BCV47 SURFACE MOUNT SILICON NPN DARLINGTON TRANSISTOR TYPICAL ELECTRICAL CHARACTERISTICS R4 (21-October 2021) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)